-Fortune- materials-science professional, accomplished in rigorous academic settings and the demanding microelectronics industry. -Considerable technical expertise in integrated-circuit formation and microvia reliability of substrates as well as strength in supplier management. -Research and scientific credentials include publications and presentations at technical events. -Bilingual (English-Spanish), and educated in three countries, I am an effective player with geographically-disperse, multi-disciplinary teams across countries, cultures and time zones. Specialties Design of experiments, electronic substrate manufacturing, materials characterization (optical microscopy and profilometry, scanning and transmission electron microscopy (SEM, TEM), X-ray diffraction and spectrometry (XRD, EDS), nanoindentation), attention to detail, confidentiality. read more ...
  • The University Of Connecticut
  • Universidad Pontificia Bolivariana
  • Test R&d Engineer At Intel Corporation
  • Sr. Packaging Engineer At Intel Corporation

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